Senior Packaging Engineer

Power Integrations Netherlands B.V. - Philippine Branch

Electrical/Electronic Engineering (Engineering)

• Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
• Drive alignment between module design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
• Develop new assembly technologies, run process DOE’s, to define process windows for new package development
• Define and Drive reliability testing and qualification of new module packages in conjunction with the reliability group
• Work closely with offshore assembly and substrate partners to develop new processes
• Work closely with New Product Definition teams to define packages to meet their requirements
• Collaborate with multi-functional teams within Power Integrations for successful development, qualification, and production ramp of new module products
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production

Job Requirements

• BS Degree in Electrical Engineering, Mechanical Engineering, Material Science
• 5 years of experience in semiconductor packaging technology
• Understanding of organic laminate technologies manufacturing and supplier capabilities.
• Experience in SMT or passive integrated package assembly is a plus.
• Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus)
• Experience with package substrate design rules, tools (including AutoCAD)
• Knowledge of AEQ Automotive reliability requirements
• Knowledge of APQP automotive development process
• Knowledge of JEDEC/IPC design standards
• Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus
• Ability to work in a fast-paced, high stress environment with high rates of change

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