DescriptionBasic Purpose of the Job
•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
•Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
•Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.
Reporting Relationship
•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
ResponsibilitiesMajor Duties and Responsibilities
•Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
•Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
•Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
•Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross‑functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
•Develop technical talent, strengthen process ownership, and balance engineering workload.
Qualifications
•Education
•Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
•Experience
•8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
•Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
•Skills & Knowledge Requirements
•Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
•Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
•Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments
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