DescriptionI. Basic Purpose of the Job
•The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.
II. Reporting Relationship
•Reports directly to the FOL Process Engineering Team Lead
ResponsibilitiesIII. Major Duties and Responsibilities
ØOwn and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
ØDrive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
ØDevelop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
ØLead process characterization through DOE, window validation, and material/tooling optimizations.
ØManage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
ØSupport customer audits, IATF/ISO compliance, and change control activities.
ØCollaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.
QualificationsIV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Mechanical, Industrial, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
oPractical experience on Orthodyne, KnS Power Fusion / platforms
oExperience with Al wire or advanced interconnects is a plus.
oExperience in thermosonic wire bonding is an advantage
•Skills and Knowledge Requirement
•Strong understanding of:
•Ultrasonic bonding fundamentals and mechanisms
•IMC formation, bond strength, and bond durability
•Pad metallization and bondability.
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•Proficient in DOE, SPC, MSA, PFMEA, and statistical problem solving
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•Familiar with wire bond‑related reliability risks and FA tools:
•CSAM, X‑ray, SEM, bond pull/shear analysis
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•Strong written and verbal communication skills
•Capable of leading technical escalations and customer‑facing discussions
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