DescriptionI. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
ResponsibilitiesI. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
QualificationsI. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
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