Packaging Engineer

Company Overview: Welcome to our innovative company, where we're dedicated to delivering high-quality products to our customers. We specialize in [mention your industry, e.g., consumer goods, electronics, pharmaceuticals, etc.], and our success is fueled by our commitment to excellence in packaging design and engineering. Join our dynamic team and be part of shaping the future of packaging technology.

Position Overview: As a Packaging Engineer, you will play a crucial role in designing and developing packaging solutions that meet our product requirements while ensuring efficiency and sustainability. Reporting to the Packaging Manager, you will collaborate with cross-functional teams to design, test, and implement packaging designs that protect our products during storage, transportation, and distribution. If you're a creative problem solver with a passion for packaging innovation, we want you on our team.

Requirements

Responsibilities:

• Define package design rules, process flow, and material set for new products, including automotive power module packages.
• Ensure alignment between module design requirements and supplier capabilities to enable new product development and volume manufacturing of power modules.
• Develop new assembly technologies, run process DOEs to define process windows for new package development.
• Define and drive reliability testing and qualification of new module packages in conjunction with the reliability group.
• Collaborate closely with offshore assembly and substrate partners to develop new processes.
• Work closely with New Product Definition teams to define packages to meet their requirements.
• Collaborate with multi-functional teams within Power Integrations for successful development, qualification, and production ramp of new module products.
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production.

Job Requirements:

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Material Science.
• 5 years of experience in semiconductor packaging technology.
• Experience in leaded multi-die packages.
• Understanding of organic laminate technologies manufacturing and supplier capabilities.
• Experience in SMT or passive integrated package assembly is a plus.
• Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus).
• Experience with package substrate design rules, tools (including AutoCAD).
• Knowledge of AEQ Automotive reliability requirements.
• Knowledge of APQP automotive development process.
• Knowledge of JEDEC/IPC design standards.
• Ability to set up Design Rule Checks for verification of every aspect of the PCB layout is a plus.
• Ability to work in a fast-paced, high-stress environment with high rates of change.

Benefits

• Competitive salary: The industry standard salary for Packaging Engineers typically ranges from $70,000 to $100,000 per year, depending on experience and qualifications.
• Comprehensive benefits package, including health insurance, retirement plans, and paid time off.
• Opportunities for professional development and career growth, including training programs and certifications.
• Collaborative and inclusive work environment with a focus on innovation and continuous improvement.
• Chance to work on diverse projects and make a meaningful impact in the packaging industry.

Join Us: Ready to design and develop packaging solutions that protect and enhance our products? Apply now to join our team as a Packaging Engineer and be part of our mission to deliver exceptional products to our customers. We look forward to welcoming you aboard!