CAD/BIM Engineer - EMI/EMC Lab (Multi-Disciplinary & Modular Integration Lead)

·       Review and refine of HVAC layouts (airflow paths, routing feasibility), electrical systems (load distribution, containment) and ELV systems (Data / RF routing)

·       Ensure constructability of design

·       Coordination across all disciplines

·       Develop LOD 350 – 400 Revit models

·       Maintain federated model (all disciplines integrated)

·       Ensure clash free model in critical zones

·       Prepare shop drawings, IFC drawings and as-built drawings

·       Ensure full alignment with BIM model

·       Control redline updates and revisions

·       Integrate shielded rooms (faraday cage interfaces) and RF penetrations (controlled openings only)

·       Ensure grounding/bonding continuity, cable segregation (clean vs noisy systems)

·       Reflect all constraints in model + drawings

·       Develop modular MEP layouts (racks and skids)

·       Prepare fabrication ready drawings

·       Validate installation sequence and access

·       Perform Navisworks clash detection

·       Resolve interdisciplinary conflicts internally

·       Ensure no design conflicts reach site

·       Support site team with drawings and clarifications

·       Update as-built model and drawings

·       Ensure final deliverables match actual installation

·      Bachelor's degree or Diploma in Civil/Mechanical/Electrical engineering, Architecture, or related field.

·     8+ years of experience in construction or engineering industry

·    Strong background in MEP design coordination, BIM + CAD integration delivery and Complex facilities (Labs/industrial/data centers).

·    Software background of Revit (Advanced – Multi discipline), AutoCAD (advanced drafting), Navisworks (clash detection) and ACC/BIM 360).

·    Technical expertise in HVAC systems (routing, performance awareness), Electrical systems (power + grounding) ELV systems (data, RF coordination) and Structural/architectural interface

·    Strong knowledge of shielding systems and enclosure interfaces, RF penetration control, grounding/bonding systems and cable segregation requirements