Job Summary:
This position is a key member of the Engineering team, in charge of improving, sustaining and troubleshooting Implant/RTP processes.
Responsible for all aspects of wafer processing within the Fab area. Implement and qualify technology/process transfers from sister sites. Drive cost reduction, yield enhancement, capacity and process optimization activities in a team environment, whilst adhering to all aspects of the company’s safety procedures. Liaising with other groups within the company.
Duties and responsibilities will include the following:
Qualifications and Education Requirements
· Degree/HND in Scientific/Engineering discipline is preferred.
Desired Skills
· 3 years plus wafer fab experience.
· Ability to work flexible hours.
· Ability to work effectively in teams.
· Ability to empower and listen to others.
· Detailed knowledge of wafer fab manufacturing processes and systems
· Familiar with all modern manufacturing concepts such as; JIT, Kaizen, Zero Defects, SPC, TQM and TPM.
· Experienced in driving continuous improvement activities and projects for assigned measurables.
· Highly motivated, results orientated customer service orientated, strong leadership and communication skills.
Experience on the following equipment:
- Applied Materials XR9500 and/or Axcelis GSD 200, Purion implanters.
- Mattson 2800 rapid thermal anneal tools.
- 3D Micromac Laser anneal.
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