The Company: This innovative advanced technology manufacturer is a recognised leader within the high-frequency electronics and semiconductor sector. Operating from a state-of-the-art facility, the company develops cutting-edge solutions used across telecommunications, defence, aerospace, and next-generation technologies.
With continued investment in people, automation, and advanced manufacturing capability, the business offers excellent long-term career progression for an ambitious Process Engineer looking to work on highly complex engineering projects within a collaborative and fast-paced environment.
Job Description: An exciting opportunity has arisen for a Process Engineer to join a growing engineering and manufacturing organisation in Sedgefield. The Process Engineer will play a key role in developing, optimising, and controlling advanced semiconductor and RF assembly processes to support both new product introduction and high-volume manufacturing.
The successful Process Engineer will focus on die attach technologies including silver epoxy, silver sinter, and eutectic attach, alongside gold wire and ribbon bonding processes. Working closely with RF Engineering, manufacturing, and quality teams, the Process Engineer will support the transition of new technologies from development into scalable production.
Key responsibilities include process development, validation, yield improvement, statistical analysis, and continuous improvement activities. The Process Engineer will also lead root cause investigations, support automation projects, and help define future manufacturing technologies aligned with the company’s long-term roadmap.
This role would suit a hands-on Process Engineer who enjoys solving complex manufacturing challenges and working within a highly technical environment. The Process Engineer will have the opportunity to influence next-generation product manufacturing while driving efficiency, reliability, and process robustness.
The company is particularly interested in candidates from semiconductor, RF electronics, power electronics, or high-precision automotive electronics backgrounds with experience in advanced manufacturing and zero-defect culture.
Skills & Experience:
* Degree qualified in Engineering, Materials Science, Physics, or a related discipline
* 5+ year’s experience in a similar role working around electronic products.
* Hands-on experience in wire bonding, die attachments, device packaging or electronic fabrications.
* Experience with process validation, SPC, Cp/Cpk analysis, and yield improvement.
* Knowledge of root cause analysis methodologies such as 8D, DMAIC, or FMEA.
* Experience supporting NPI and manufacturing process development Only candidates based in UK and eligible to work in UK are allowed
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