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3D NAND TD Device Engineer

icon building Company : Solidigm
icon briefcase Job Type : Full Time

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Job Description - 3D NAND TD Device Engineer

Company Description

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Job Description

As a TD NAND Device Engineer, you will be responsible for analyzing device characteristics and driving process and integration solutions for the next generation innovative 3D NAND technologies to meet the required performances and reliability specs within project timelines. The position may be Sr. Staff or Principal Engineer/Director level depending on qualifications.

Key Responsibilities :

  • Understand NAND devices operation, E-parameter test, reliability tests, product qualification performance and reliability requirements.
  • Drive process and device technology evolution and innovations to meet performance and reliability targets within project timeline, through problem segmentation and DOE, followed by in-depth data analysis with device physics understanding.
  • Extract and analyze inline, parametric, probe and reliability data for thorough data analysis.
  • Collaborate with process integration engineers to define structural specifications for next generation 3D NAND technologies to meet device and product array requirements.
  • Collaborate with product engineers to improve array performance and reliability with device physics understanding.
  • Join cross-functional teams to address device/array/product qualification issues (design/PIE/process/PE).
  • Ensure successful ramp and qualification of current technology node.

Qualifications

  • Masters in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, Physics or a related field.
  • Minimum of 5 years of experience in the semiconductor industry in the areas of Memory device technology and/or Process Integration.
  • Proficient understanding of the NAND device, cell operation, reliability and performance trade-offs and product qualification.
  • In-depth knowledge on semiconductor process flow (preferably nonvolatile memories) with good material and structural understanding is desirable.
  • Experience in memory technology R&D and transfer is preferred.
  • Highly self-motivated, self-driven with proven track record to work in a demanding & dynamic environment.
  • Ability to solve complex device problems.
  • Ability to effectively coordinate with cross-functional teams.
  • Solid data analysis capability, communication and presentation skills.

Additional Information

For California, Colorado, New York, Washington, and remote roles: The compensation range for this role is $180,270- $301,400. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.

 

This job is posted primarily for Sacramento area or San Jose area (Hybrid work model). Remote/alternative locations will be considered for exceptional candidates.

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