Advanced Package Development Engineer

Position Overview

We are seeking an Advanced Packaging Engineer with expertise in advanced packaging technologies, including 2.5D CoWoS, bridge-based multi-die assembly, and high-density chiplet integration. This individual will drive the development, integration, qualification, and production ramp of advanced IC packaging solutions for high-performance, next-generation semiconductor products.

This role requires hands-on experience with advanced packaging development, fine-pitch interconnect, substrate and interposer technologies, and multi-die/package co-design. The successful candidate will interface closely with foundries, OSATs, substrate vendors, and system engineering teams to drive process optimization, and volume production.

Responsibilities 

• Leading and execution of evaluation of materials, processes, and design rules for multi-die packaging (e.g., chiplets on interposer or bridge-based platforms).
• Drive package integration flows, including die attach, microbump bonding, assembly, underfill, molding, and substrate attach processes.
• Partner with foundry and OSAT vendors to oversee engineering builds, tooling readiness, material availability, and risk mitigation strategies during development.
• Lead early learning, risk mitigation, and qualification activities for multi-die integration using 2.5D interposer.
• Evaluate and implement design-for-manufacturing (DFM), design-for-yield (DFY), and design-for-reliability (DFR) best practices into packaging flow.
• Support root cause analysis and corrective actions for process or yield-related issues, including material or assembly-related excursions.
• Lead coordination of package process improvements, early learning activities, and qualification milestones for multi-die chiplet integration using 2.5D CoWoS, and MCM packaging assembly methods.
• Guide thermal, mechanical, and electrical tradeoff assessments during early-stage package design and development.
• Contribute to the definition of material specifications, integration process flows, and best practices for scalable package development.
• Interface with cross-functional teams to ensure packaging solutions meet technical requirements, BOM, and program schedules.
• Support root cause analysis and corrective action processes for build issues, resolve quality excursions, and material-related challenges.
• Ensure packaging solutions meet DFM, thermal, mechanical, and reliability targets at both the component and system levels.
• Contribute to the development of material specifications, process flows, and integration guidelines based on test vehicle results and partner feedback.
• Deliver regular technical updates, risk assessments, and milestone reports to internal and external stakeholders.

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Chemical Engineering, or a related field.
• 8+ years of hands-on experience in advanced IC packaging and multi-die integration, including 2.5D CoWoS or bridge-based assembly.
• Proven track record developing and qualifying package technology’s enablement and process optimization and validation.
• Understanding of substrate technology, interposers, die-to-die interconnect, and fine-pitch multi-chip assembly.
• Experience with manufacturing and foundry partners and system integrators for packaging and product builds.
• Familiarity with package and board-level reliability methods, reliability testing such as thermal cycling,  and mechanical stress evaluations.
• Knowledge of DFM, DOE, DFY, FMEA, FA/debug methodologies, to identify critical process windows, material attributes, and process qualification flows.
• Highly self-motivated, detail-oriented, organized, and capable of managing multiple priorities independently in a dynamic development environment.

Why Join Us?

At Eridu AI, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.  

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.