Advanced Packaging Integration Engineer

Join the Photonics Platform Business Group within the CTO Office at Applied Materials\u2019 Santa Clara headquarters, where you will work with a world\u2011class research team developing next\u2011generation silicon photonics packaging technologies. This role focuses on enabling high\u2011performance optical interconnects and co\u2011packaged optics through innovative advanced packaging and 3D integration solutions.\n\nAs an Advanced Packaging Integration Engineer, you will lead process integration for high\u2011performance interconnects and microLED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, substrate and connector suppliers, and cross\u2011functional teams across Applied Materials and external partners. You will work closely with design, process, packaging, and metrology teams to deliver production\u2011ready solutions.\n\nKey Responsibilities\n\n * Define, develop, and optimize advanced packaging process integration flows (e.g., 3D heterogeneous integration, die stacking, hybrid bonding) to achieve best\u2011in\u2011class performance, yield, and reliability.\n * Lead and manage complex technical programs, drive schedules, resolve technical challenges, and ensure on\u2011time, high\u2011quality deliverables.\n * Design controlled experiments, collect and interpret data, perform root\u2011cause analysis, and implement corrective actions.\n * Collaborate with foundries, OSATs, and Applied Materials research teams to define and implement improved integration methodologies.\n * Track industry and competitive advancements and strategically apply new knowledge to drive innovation.\n\n\n\nQualifications\n\n * M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM discipline.\n * In\u2011depth knowledge and hands\u2011on experience in advanced packaging technologies, including wafer\u2011to\u2011wafer or die\u2011to\u2011wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply.\n * Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.\n * Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP). Coding experience is a plus.\n * Experience with MES systems is a plus.\n * Ability to prepare clear, compelling executive\u2011level or customer\u2011facing presentations is a plus.\n * Self\u2011starter with strong problem\u2011solving skills; able to work both independently and in team environments with minimal supervision.\n\n\n\n## Qualifications\n\n### Education:\n\nBachelor\u0027s Degree\n\n### Skills\n\n### Certifications:\n\n### Languages:\n\n### Years of Experience:\n\n4 - 7 Years\n\n### Work Experience:\n\n## Additional Information\n\n### \n\n### Shift:\n\n10-Day 8-Hr (United States of America)\n\n### \n\n### Travel:\n\nYes, 10% of the Time\n\n### \n\n### Relocation Eligible:\n\nYes\n\n### Referral Payment Plan:\n\nEmployee Referral (Standard)\n\nU.S. Salary Range:\n\n$138,000.00 - $190,000.00\n\nThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. \n\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\n\nApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. \n