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Chip Engineer #ESF9263

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icon briefcase Job Type : Full Time

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Job Description - Chip Engineer #ESF9263


























Job Type : Full Time
Location : San Jose, California
Pay : Excellent
Job Description
What You Will Be Doing

  • Own and develop Die Attach and Flip Chip assembly processes end-to-end

  • Drive process development, optimization, and yield improvement (~95%)

  • Work in a high-mix, low-volume environment, managing multiple projects simultaneously

  • Design and execute DOE (Design of Experiments) for new product introductions (NPI)

  • Analyze yield issues and implement process improvements on the production line

  • Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)

  • Support RFQs with process inputs and technical feasibility

  • Train technicians and operators on new processes and quality standards

  • Contribute to advanced photonics and active alignment assembly (training provided)

  • Work with or learn advanced tools like die bonders, pick-and-place, alignment systems

Experience You Will Need

  • 2+ years of hands-on experience in Die Attach and Flip Chip process development

  • Proven ability to develop and optimize processes with high yield (~95%)

  • Experience in semiconductor packaging or related micro-assembly (RF, MEMS, etc.)

  • Strong understanding of DOE, SPC, and yield improvement methodologies

  • Ability to multi-task in a fast-paced, high-mix environment

  • Exposure to equipment like ESEC/Evo, Hesse, Amicra, FineTech, Disco, ficonTEC (or similar)

  • Basic to intermediate exposure to software/tools (SolidWorks, MATLAB, Python, LabVIEW)

  • Background in optics/photonics is a plus (training will be provided)

  • Bachelor’s degree in Engineering or related field

Must-Have



  • Hands-on Die Attach (DA) & Flip Chip (FC) process development

  • Strong yield improvement (SPC, DOE) experience

  • Ability to work in high-mix, low-volume environment

  • Multi-project handling & fast learning ability

  • Strong ownership mindset & commitment

Nice-to-Have



  • Photonics / Optoelectronics exposure or coursework

  • Experience with active alignment systems

  • Familiarity with advanced assembly equipment (Evo, Hesse, Amiga, FineTech, Disco, ficonTEC)

  • Exposure to micro-assembly (RF, MEMS, optics)

  • Programming/tools: Python, MATLAB, LabVIEW, SolidWorks

Our client asked me to submit 3 great people within the next few days. We work directly with the hiring manager and can arrange interviews within a few days
Tom S

#INDEH123
Original job Chip Engineer #ESF9263 posted on GrabJobs ©. To flag any issues with this job please use the Report Job button on GrabJobs.
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