【線上面試】製程專案工程師(光模組/Die Bond/Wire Bond)

Company : Usi Careers

Job Type : Full Time

Nantou City

Job Description - 【線上面試】製程專案工程師(光模組/Die Bond/Wire Bond)

1. 負責Die bond/Wire bond等製程改善與優化

2. 負責製程設計與作業指導書設定、

3. 優化製程參數，以及改善相關需求的實驗計畫法、PDCA、QC七手法等相關實驗與資料分析

【需求條件】

1. 具Die Bond或Wire Bond或 Optical Alignment製程生產經驗三年以上

2. 具新製程導入與製程優化等經驗者佳。

3. 熟悉DOE實驗設計、QC七手法與8D分析者佳。

4. 具TOEIC 500分以上者佳。

關於USI的技術能力：https://www.youtube.com/watch?v=7FYWRdqwTVU
USI的教育訓練與各項福利：https://www.instagram.com/usi_career/

#LI-ER

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【線上面試】製程專案工程師(光模組/Die Bond/Wire Bond)

Job Description - 【線上面試】製程專案工程師(光模組/Die Bond/Wire Bond)

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