DRAM Process Integration Engineer

Lead technology integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components such as charge storage devices and thin-film transistors (TFTs), among others. Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to yield and margin issues Design and handle experiments in the R&D fab Optimize process flows and develop creative solutions to meet product requirements. Extract, supervise, analyze, and react to inline data, defect data, param data and probe data to fix yield issues, performance, reliability, add process margin and reduce costs. Lead continuous yield improvement and cost reduction activities. Summarize sophisticated problems, derive, explain actions taken to address them and drive team to implement them. Detailed knowledge of mainstream memory technologies such as DRAM, NAND, etc. acquired through significant proven contributions. Expertise in semiconductor device physics. Strong understanding of semiconductor process integration and process development. Familiarity with both process integration & circuit/architecture issues as they relate to memory. Proficientcy with data analysis, DOE, and statistical techniques. Proven project management skills and experience driving cross-functional technical teams. M.S. or PhD in a related field with 5+ years of experience (required).