Global Quality IC Package Design/Development Quality Assurance Principal Engineer

Execute technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/design rules and lead risk mitigation execution. Develop holistic qualification plans and coordinate execution. Provide recommendations on releasing new package technologies based on test results and technical risk assessments. Serve as SME for problem-solving related to package technology, ensuring effective root cause analysis and corrective/preventive actions. Collaborate with customer-facing teams to draft and present content addressing customer issues and requests. Provide SME support and mentoring to elevate package reliability engineering knowledge across the company. Master's degree or equivalent experience in Electrical/Electronics, Mechanical, Material Science and Engineering, Physics, or related field. 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R). Experience with advanced packaging technologies (e.g., 3DI, Wafer-2-Wafer, SiP). Expert-level applied knowledge of package-level and board-level reliability test methods, reliability acceleration modeling, and sampling statistics. Expert-level understanding of Chip-Package Interaction and effects of thermomechanical and hygroscopic swelling stresses on reliability. Thorough knowledge of semiconductor package designs, assembly processes, and board-level reliability challenges. Understanding of mechanical and material interaction effects on IC component and PCB assembly reliability. Knowledge of statistics and quality management tools (SPC, FMEA, 8D CAR). Self-motivated, detail-oriented, and able to work independently with strong analytical and multi-tasking skills. Excellent written and verbal communication skills in English. Ability to mentor and publish technical papers (internal and external). Experience collaborating with industry standards bodies and driving beneficial changes. Strong problem-solving skills and ability to interact effectively with cross-functional teams.