Hardware/Product Development Engineer, PLM - (E4)

Your responsibilities will include conducting feasibility studies, developing engineering prototypes, and testing new and modified designs, ECO to release new part numbers. Design and develop mechanical components and assemblies for EPI/FEP systems. Conduct feasibility studies and prototype development for new concepts. Perform thermal analysis and simulation for conduction and convection-based mechanisms. Apply Model-Based Definition (MBD) and tolerance analysis in designs. Collaborate with cross-functional teams and suppliers to ensure design integration. Support field teams with technical guidance and troubleshooting. Document designs and maintain compliance with engineering standards and FMEA practices. Perform FA using 8D methodology Conduct requirements studies of customer high-value problem (HVP) BS in Mechanical, Thermal, or Physics; MS in Mechanical Engineering preferred. BS + 5 years minimum OR MS + 2 years minimum in semiconductor test industry, semiconductor capital equipment, or high-technology environments. Proficient in NX and Model-Based Definition (MBD). Strong background in thermal systems (conduction and convection mechanisms). Knowledge of heat transfer fundamentals and FEA basics. Experience in thermal simulation and analysis. Familiarity with FMEA and tolerance analysis. Experience designing compact mechanisms. Strong analytical and synthesis capabilities. Excellent verbal and written communication skills. Ability to multitask, prioritize, and manage time effectively. - minimum of 5 years experience hands on experience in EPI or FEB strongly preferred! - minimum of a Bachelor's Degree in Engineering (Mechanical Engineering preferred) - Must be based in Santa Clara/vicinity (no relocation available)