Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications. Partner cross-functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges. Works closely with customer to introduce and drive adoption of new technologies at customer sites. Contribute to next generation product development and release activities supporting the semiconductor roadmap. Provide leadership, clear direction, and guidance to process technicians to support execution activities. Conduct process engineering research, development, and evaluation in support of Lam's cutting-edge semiconductor equipment and systems. Review and enhance processing techniques and methods applied in the manufacture and fabrication of products. Master's degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 8+ years of experience; or a PhD with 5+ years' experience; or equivalent experience. Ability to travel to and work effectively at customer sites. Ideal candidate will be fluent in at least two languages. Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc. Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners. Background in Advanced Packaging, Wafer Level Packaging (WLP), Through Silicon Via (TSV), Electrochemical Deposition (ECD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD). In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE). Working knowledge of statistical analysis and problem-solving methodologies. Experience with statistical tools (JMP, Minitab, etc.) Knowledge of Material synthesis and material characterization.
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