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Lead, PCB Design - Signal Integrity - Stackup Specialist (Various Locations)

Job Description - Lead, PCB Design - Signal Integrity - Stackup Specialist (Various Locations)


Job Title: Lead, PCB Design – Signal Integrity/Stackup Specialist 


Job Code: 46234


Job Location: Palm Bay, FL, Carlsbad, CA or Herndon, VA


Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off    


 


Job Description:


L3Harris has an immediate need for a Signal Integrity/Stackup PCB Design Specialist whose role defines and optimizes rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints.


You will work closely with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA  requirements into practical, production-ready signal integrity and board-layer strategies. This is a hands-on PCB design role with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance.  Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives.


 


Essential Functions:



  • Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.

  • Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.

  • Partner with electrical engineers to translate Signal Integrity(SI)/Power Integrity(PI) requirements into practical routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance.

  • Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.

  • Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.

  • Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance.

  • Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.

  • Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.

  • Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.

  • Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.

  • Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.

  • Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer 

  • Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements.


 


Required Qualifications:



  • Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.


 


Preferred Additional Skills:


 



  • Proficiency with Siemens Xpedition PCB design or experience with similar tools.

  • Experience using Siemens HyperLynx Z-planner for PCB stackup design.

  • Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs.

  • Cadence Allegro and Altium PCB experience.

  • Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.

  • Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.

  • Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.

  • Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.

  • IPC Certified Interconnect Designer (CID/CID+)


 


In compliance with pay transparency requirements, the salary range for this role in California and in Virginia - Greater Washington, D.C. area is $110,500- $205,000 . This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee  


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