LFAB Device & Process Integration Branch Manager

LFAB Process Integration Branch Manager

Working in a state-of-the-art, growing 300mm, 65nm and below analog and embedded wafer fab in Lehi, Utah.

In this role you will be part of the factory leadership and lead the Process Integration team, where primary responsibilities will include (a) ownership of parametric performance and yield improvement, (b) driving operational focus on parametric test output evaluation, (c) leading the process integration team in semiconductor device monitoring, device improvement activities, integration projects to support increased yield and product performance, (d) working closely with the factory leadership team to meet daily operational and strategic technology goals, (e) leading the factory in finding effective solutions to technology issues and yield improvement in a time constrained environment, (f) utilizing technical and practical experience to drive factory quality decisions and actions, (g) leveraging experience and management skills to ensure technology transfers and development meet commitments, (h) partnering with factory leadership to define and execute strategic roadmaps.

As part of this role, you will have director level people responsibilities (manager of managers) and direct responsibility for continued improvement of the process integration team’s effectiveness.  As the Process Integration Branch Manager you are expected to be highly experienced in both semiconductor device physics and process integration as you will be required to both drive decisions and coach factory team members at all levels in devices, integration, project execution, and continuous improvement. 

Demonstrated Qualification:

• Effective director level leadership (experience leading managers and individual contributors):  defining and meeting aggressive goals, strategic and tactical execution, team development


• Effective communication to senior management and overall organization


• Strategic planning in a combined volume semiconductor manufacturing and new technology introduction environment


• Leading technology development and transfer activities, both technical and execution


• Day to day leadership in a fast paced, 24x7 manufacturing site with a rapidly changing environment.


• Deep technical and practical understanding of semiconductor device physics


• Expertise and ownership of semiconductor device characterization and manufacturing parametric data, 65nm and below.


• Expertise and ownership of semiconductor process integration in a manufacturing environment, 65nm and below.


• Practical understanding of 65nm-28nm process integration


• Experience in 65nm and below process technology nodes


• General knowledge of unit process physics and manufacturing operations


• Strong analytical and problem-solving skills


• Strong verbal and written communication skills


• Ability to work in teams and collaborate effectively with people in different functions


• Demonstrated ability to build strong, influential relationships


• Work effectively across organizational boundaries, fab sites, development teams, business units

Process Integration Branch Manager Responsibilities:

• Leadership team member responsible for “24x7” volume manufacturing fabrication facility


• Proactive alignment and communication with factory leadership team


• Factory level goal definition and attainment


• Define and set process integration goals to support factory level goals


• Deliver on daily tactical factory priorities (ownership of parametric performance and execution)


• Deliver on strategic factory priorities


• Identify and drive longer term company technology and manufacturing group initiatives


• Define, initiate and implement strategic initiatives to impact factory and TI technology and manufacturing group performance


• Optimize the process integration and factory organization to its most effective state, with ongoing reassessment


• Leadership in technology transfer and development activities including project execution, technical assessment, and communications


• Leader of process integration team covering all technologies released to manufacturing


• Owner of technology parametric performance/yield (all components and overall integration)


• Plan effectively, drive schedules, meet critical deadlines on multiple projects in parallel


• Coach and develop leaders and team in technical understanding, management, and project execution


• Lead and drive technical discussions around the performance of a broad portfolio of semiconductor components 


• Lead and drive technical discussions around the process integration at 65nm and below nodes


• Lead and coach team in critical, high pressure, time constrained technical problem-solving activities


• Clearly communicate technology and project status and actions to senior management and overall organization


• Interface with multiple organizations on a diverse team to accomplish goals.

Minimum requirements:

• Masters or PhD in EE/ECE or semiconductor specific solid state physics, applied physics or quantum mechanics


• Experience working in a high-volume semiconductor factory with expertise in semiconductor devices and transition of new technology from introduction to production on schedule (high volume)


• Experience in a high-volume semiconductor factory as a device or process integration manager.