Manager, Process Engineering - PECVD

Position Summary

ASM is seeking a highly motivated Manager, Process Engineering to lead a team of process engineers within the PECVD (Plasma Enhanced Chemical Vapor Deposition) KPU. This role is responsible for driving process technology development, customer deliverables, productivity improvements, and technical leadership supporting next-generation semiconductor logic, memory, and advanced packaging applications.

The successful candidate will combine deep PECVD process expertise with strong people leadership, guiding a team responsible for process development, optimization, characterization, and customer demonstrations. This individual will work closely with R&D, Product Management, Applications Engineering, Hardware Engineering, Manufacturing, and customers to develop differentiated process solutions and support ASM's technology roadmap.

Key Responsibilities

• Lead, develop, and manage a team of process engineers focused on PECVD thin film applications for logic, memory, and advanced semiconductor devices.


• Establish team priorities, allocate resources, and drive execution against business objectives, customer commitments, and technology roadmaps.


• Oversee development, optimization, and qualification of PECVD processes to meet film performance, productivity, and manufacturability targets.


• Drive continuous process improvements to achieve customer specifications and address critical technology challenges.


• Lead root cause analysis and problem-solving activities related to process performance, yield, integration, and productivity.


• Collaborate with R&D, Product Engineering, Product Management, and Hardware Engineering teams to develop next-generation PECVD solutions.


• Partner with global customers to understand technical requirements, support evaluations, and enable successful process transfers into manufacturing.


• Manage project planning, execution, and prioritization of experiments, wafer processing, characterization activities, and customer deliverables.


• Use data-driven methodologies to analyze process performance and provide technical recommendations that influence product and technology decisions.


• Support customer escalations and provide technical leadership for complex process challenges.


• Recruit, mentor, and develop engineering talent while fostering a culture of innovation, accountability, collaboration, and continuous learning.


• Drive best practices in process development, documentation, knowledge sharing, and engineering excellence across the PECVD organization.

Qualifications

Required

• Master's degree or Ph.D. in Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.


• 8+ years of semiconductor process engineering experience with significant focus on thin film deposition technologies.


• Prior people management experience or demonstrated success leading technical teams and cross-functional projects.


• Strong background in PECVD, CVD, ALD, or related thin film deposition technologies.


• Experience developing and optimizing semiconductor processes for logic, memory, advanced packaging, or specialty semiconductor applications.


• Demonstrated ability to lead complex technical programs and deliver results in a fast-paced environment.


• Strong problem-solving, project management, and organizational skills.

Preferred

• Experience with dielectric films, nitrides, oxides, low-k materials, or other advanced thin film applications.


• Understanding of semiconductor device physics, process integration, and manufacturing challenges.


• Experience working directly with semiconductor customers in a process development or applications engineering role.


• Familiarity with statistical process control (SPC), DOE methodologies, and advanced data analytics techniques.


• Experience supporting technology transfers from development into high-volume manufacturing.


• Background in plasma processes and plasma-material interactions.

Skills & Competencies

• Deep technical expertise in semiconductor thin film deposition and process development.


• Strong understanding of semiconductor manufacturing, process integration, and device performance requirements.


• Ability to analyze large datasets and drive insights through statistical and data-driven methodologies.


• Excellent communication skills with the ability to present technical concepts to customers, executives, and cross-functional stakeholders.


• Demonstrated ability to prioritize multiple projects and resources while meeting aggressive timelines.


• Proven coaching and talent development capabilities.


• Strong collaboration and leadership skills across global and multifunctional organizations.


• Customer-focused mindset with a passion for innovation and technology advancement.

Why ASM

Join a world-class team shaping the future of semiconductor manufacturing through advanced deposition technologies. As Manager of Process Engineering within the PECVD KPU, you will have the opportunity to lead a high-impact team, influence technology strategy, and work directly with leading semiconductor customers on the industry's most advanced device architectures.