Materials Scientist - Advanced Packaging Metallization

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Position Overview

Qnity Electronics has an exciting and challenging opportunity within Advanced Circuit & Packaging (ACP) for a Materials Scientist located in Marlborough, MA. This role focuses on materials and metallurgical innovation for advanced packaging interconnects, with strong emphasis on grain engineering for Cu-Cu bonding and intermetallic compound (IMC) behavior, barrier layer performance, and reliability of Cu / barrier / SnAg solder systems.

The successful candidate will provide technical leadership in grain engineering, microstructure control, IMC suppression, and reliability characterization for next‑generation metallization technologies supporting microbumps, Cu pillars, TSV, and hybrid bonding applications.

Key Responsibilities

Materials & Metallurgical Leadership

• Lead materials and metallurgical development for advanced packaging metallization, with focus on Cu, barrier layers, and SnAg solder interconnects.
• Establish structure–property–process relationships linking plating chemistry, deposition conditions, and thermal history to microstructure and reliability.
• Drive grain engineering and microstructure tuning to enable fine‑pitch, high‑reliability interconnect architectures.

Intermetallic Compound (IMC) & Interface Characterization

• Lead intermetallic compound (IMC) characterization at Cu / barrier / SnAg solder interfaces, including IMC phase identification, morphology, thickness, and growth kinetics.
• Investigate Cu–Sn, Cu–SnAg, Ni–Sn, and mixed (Cu,Ni)₆Sn₅ / (Ni,Cu)₃Sn₄ IMC systems under reflow, thermal aging, and high‑temperature storage conditions.
• Evaluate and down‑select barrier materials and alloys to mitigate excessive IMC growth, voiding, and interfacial degradation.
• Correlate IMC evolution with co‑planarity, joint geometry, diffusion behavior, and interconnect scaling limits in fine‑pitch and mixed‑CD designs.

Reliability Characterization & Failure Analysis

• Design and execute reliability characterization strategies for advanced packaging interconnect stacks, including multi‑reflow exposure, thermal aging, and stress‑driven degradation studies.
• Perform failure analysis linking IMC behavior and microstructural evolution to reliability risks such as cracking, spalling, voiding, and joint embrittlement.
• Translate IMC and reliability learnings into material design rules, barrier selection guidelines, and plating process optimization.

Advanced Characterization & Problem Solving

• Lead advanced materials characterization using techniques such as SEM, TEM, EBSD, XRD, AFM, EDS line scans, and FIB/PFIB cross‑sectioning.
• Drive root‑cause analysis for complex, low‑precedent metallization and reliability challenges.

Program Leadership & Collaboration

• Lead technical projects through structured innovation and stage‑gate processes; define plans, milestones, and deliverables with accountability for outcomes.
• Mentor and technically guide team members; influence cross‑functional teams through scientific leadership.
• Communicate results clearly to internal stakeholders, customers, and partners through reports and technical presentations.

Documentation, IP & Safety

• Maintain rigorous technical documentation and support intellectual property generation.
• Demonstrate strong commitment to laboratory safety and safe operating practices.

Required Qualifications

• Ph.D. in Materials Science, Metallurgy, Chemistry, Chemical Engineering, or closely related field (or M.S. with significant equivalent industry experience).
• Demonstrated expertise in metallic materials, solder metallurgy, thin films, interfaces, and microstructure–property relationships.
• Hands‑on experience with advanced materials characterization applied to interconnects and reliability analysis.
• Proven ability to lead complex technical programs and collaborate across disciplines.
• Strong written and verbal communication skills.
• Ability to work legally in the United States.

Preferred Qualifications

• Experience with IMC analysis in Cu–Sn, Cu–SnAg, and barrier–SnAg systems, including post‑reflow and thermal aging conditions.
• Experience with barrier layer and barrier alloy development for IMC suppression and reliability improvement.
• Background in solder joint reliability, microbump metallurgy, or advanced packaging interconnects.
• Familiarity with electroplating and electrodeposition processes for Cu, solder, and Ni‑based materials.
• Track record of technical publications, patents, or conference presentations.

What Success Looks Like

• Establishes IMC‑reliability structure–property relationships that directly influence metallization platform roadmaps.
• Delivers actionable materials guidance that improves interconnect reliability, scalability, and customer qualification outcomes.

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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.

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