Mechanical Engineer SoC to Rack Integration

Required Qualifications

• B.S. or M.S. in Mechanical Engineering.
• Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
• Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
• Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
• Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of drip-free connector integration.
• Proficiency in FEA tools for structural and vibration analysis.
• Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.

Preferred Qualifications

• Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
• Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
• Experience with blind-mate liquid and power interfaces.