Member of Technical Staff, Wet Process

Own critical taskforces, take ownership of critical initiatives, and lead cross-functional technical teams to execute new tech node yield roadmap. Collaborate closely with process integration, technology development, and local yield teams to improve new technology. Guide and mentor team members, fostering a culture of continuous learning and career development. Cultivate an innovative mindset, identifying opportunities for process improvements that align with state-of-the-art product requirements while optimizing cost. Develop a fundamental understanding of process engineering and its impact on overall process health. Provide engineering support to internal team members and senior leadership! 10+ years of semiconductor experience in HVM, TD, or operations environments, with a consistent track record of technical execution. Deep expertise in Wet Process and/or CMP, including process engineering, process transfer, and Wet Etch methods such as vapor etch, dry strip, dry bevel etch, plating, bath, and spin processes. Proven track record to lead suppliers and establish effective supplier accountability programs. Strong understanding of manufacturing team structures, standards, and processes, with the ability to build a values‑driven, high‑performing culture. Excellent verbal and written communication skills, with demonstrated leadership, coaching, and mentoring capabilities. Bachelor's or Master's Degree in Chemical Engineering, Electrical Engineering, Materials Science, or related field with equivalent experience. Proven process engineering technical leadership in an HVM/TD facility (5+ years). TD background with a penchant to be in HVM will also be considered. Excellent analytical and problem-solving skills, with a meticulous approach. Innovation: Track record of providing innovative solutions. Strong communication skills and demonstrated leadership in driving collaboration between different teams.