MTS/SMTS/DMTS - Advanced Packaging Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Are you seeking an intellectually stimulating role? We are seeking someone to help lead Micron’s Advanced Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs. Additionally we aim in meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost! We collaborate with Micron’s multi-functional team which includes Product Development, 3DI wafer level process, Assembly, Test, Manufacturing and Global Quality. We directly interact with senior executives on the Development and Certification Strategy of 2.5D/3D, Flip Chip and Stacked Die Wire bonded Packages. Together, we will be responsible for crafting the Test Vehicle Development Strategy, and execution to definition, development, and delivery of innovative product/packages that will craft the future of sophisticated computing!

Responsibilities:

• Build the Establish Project Program (EPP) documents for 2.5D/3D packages.
• Drive technology integration activities for the test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Interface closely with multi-functional team and lead the product/package to mass production.
• Support and collaborate with customers to ensure that Micron’s products can meet their quality, reliability, system, and operational needs.

Minimum Qualifications:

• A Masters or Ph.D. in an Engineering Subject area - Electrical Engineering, Computer Engineering, Chemical Engineering, Materials Science & Engineering.
• 7+ years of experience in interpreting die, package, & system level design & simulation (thermal/mechanical/electrical) methodologies and results.
• 3+ years of experience communicating sophisticated technical concepts to both Sr. Leadership & Executives.
• Problem Solver

Preferred Qualifications:

• 3+ years Experience with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
• 7+ years Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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