Packaging Engineer E5

The successful candidate will be responsible for: Program Managing customer engagements in Advanced Packaging, with focus on thermal management, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time. Developing new modules leveraging Applied's wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging. Filing new patentable developments. Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and Senior/Managing directors across Applied's business units, including the packaging business unit. Helping structure and maintain Applied's roadmap in Packaging modules. Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied. Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging. Creating roadmaps for some packaging applications and helping to shepherd Applied's product portfolio. Lead project across organization and culture in a fast-paced environment Self-starter, team player and able to work independently with minimal supervision