1. Collaborate with TD, suppliers, and global facilities/layout teams to optimize tool‑install sequencing, qualification, ramp models, and readiness. Provide technical leadership during first‑of‑kind workstation introductions, ensuring manufacturing availability and utilization meet targets. Work with Process and Equipment Engineering teams, Quality Engineering, Central Planning, Procurement, and external suppliers to resolve issues and drive engineering improvements. Evaluate technical and operational solutions to reduce downtime, technician labor demand, and material/scrap cost. Ensure standardization of solving flows, tool health metrics, and scanner capability indices across sites. Provide expert guidance on TOR, BKM governance, process windows, and technical decision frameworks. Benchmark site performance and establish best‑known‑methods (BKMs) to reduce variability and elevate network standards. Lead assessments and recovery actions for recurring issues, chronic network bottlenecks, and tool performance gaps. 6+ years of relevant semiconductor photo processing or scanner engineering experience. Bachelor's or Master's degree in Engineering (Electrical, Mechanical, Physics, Materials, or related field). Excellent communication and teamwork skills, including supplier engagement. Proven track record to lead multi-functional and cross‑site engineering initiatives. Strong expertise with scanner hardware, applications, diagnostics, and process‑equipment interaction. Technical leadership in Photo technical engineering functions with excellent project management knowledge Experience with ASML scanners and advanced technology node ramps. Demonstrated success in driving large‑scale manufacturing or equipment performance programs. Experience with structured problem solving (8D, DOE, SPC).
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