Photonics Packaging Engineer

Photonics Packaging Engineer. As we scale, you will be instrumental in building our foundation from the ground up. This is a dynamic, hands-on role for a self-starter who thrives in a fluid startup environment. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth. Your key responsibilities are as follows:

Accountable for assisting in the design and analysis of laser and photonic products.

Create innovative laser packages for both free-space and fiber-coupled (single & multimode) outputs.

Participate in designing the optical architecture of the laser.

Design hermetic optical and electrical feedthroughs and conduct hermeticity testing.

Design, analyze, optimize, and test adhesive bonds for structural and thermal applications.

Develop packages and lids that are suitable for laser welding and parallel seam sealing methods.

Create electrical routing strategies using wire/ribbon bonding and flexible circuit designs.

Design and enhance solder joints for die bonding and vacuum reflow bonding purposes.

Develop solutions for thermal management and control in compact laser packages.

Utilize computer-aided engineering design software while performing tasks.

Demonstrate the ability to work autonomously while providing regular progress updates and status reports.

Design, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages.

Conduct thorough design reviews for both design and manufacturing teams.

Execute thermal, structural, and vibration modeling of intricate opto-mechanical assemblies.

Engage in prototyping, assembly, and testing to characterize design objectives.

Facilitate the procurement of hardware components.

Prepare engineering change orders and create manufacturing work instructions.

Develop, acquire, fabricate, and build prototypes to mitigate significant development risks.

Assist in root cause analysis for failures.

Provide support and mentorship to junior engineers.

Requirements

This position requires access to export-controlled information. Employment is contingent upon the applicant being a U.S. person as defined by 8 U.S.C. § 1324b(a)(3).

Experience:

Bachelors degree in mechanical engineering or related technical field.

Minimum of 5 years of experience, preferably in laser packaging.

Skills:

Proficiency in relevant technologies and application areas.

Capability to independently lead a technical team.

Experience in laser packaging.

Experience in packaging photonic integrated circuits.

Ability to operate engineering testing and optical laboratory equipment.

Familiarity with optical modeling software, with a preference for Zemax.

Proficient in CAD software, particularly SolidWorks and PDMWorks.

Experience with finite element analysis (FEA) tools, specifically ANSYS structural and Icepak.

Knowledge of multimode, single-mode, and polarization-maintaining fiber.

Benefits

The expected annual salary range for this position is $85,000-$150,000.