Principal Field Applications Engineer

Job Overview

As a Principal Field Application Engineer for TE Connectivity, you will focus on the design, simulation, and verification-validation testing of TE products in the connector and/or cable assembly industry — targeting high speed communications and connectivity within data centers, wireless infrastructure, and/or power infrastructure. You will be expected to independently work on projects for product and system design including modeling, simulation, testing and board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success.

Job Requirements

Responsibilities:

• Subject matter expert in signal integrity or power design, simulation and validation activities through product development cycles


• Establishing design performance/functional requirements for new products


• Performing simulations as needed on each product.


• This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.


• Creating actionable recommendations based upon design reviews and simulation results


• Guiding connector design and component qualifications.


• Making data driven decisions about the product functionality and areas for improvement.


• Participates in determining objectives and approaches to assignment.


• Works under general direction.


• Exercises discretion and independent judgement.


• Collaborates with other colleagues and peers.


• May coach and train other employees.

What your background should look like

Skills, Experience and Education:

• Bachelor’s degree in Electrical Engineering or Mechanical Engineering, Master’s degree preferred


• Minimum of 7 years of work experience in an engineering role


• Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twin ax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system, power and power integrity


• A solid understanding of electrical circuit behavior


• Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions


• Familiarity with printed circuit board design, fabrication and assembly.


• Experience in project leadership, especially across design, development & manufacturing teams


• Excellent verbal and written communication skills


• Ability to work in a global environment


• Highly motivated, quick learner, able to work independently

Nice to Have:

• Six Sigma methodologies or other strong data analytics background


• Printed circuit board design, fabrication and assembly (Altium, AutoCAD)


• Test equipment (oscilloscope, vector network analyzer, BERT)


• Communication systems (high-speed servers, switches, routers, storage)


• Power systems experience (power distribution throughout the rack)


• Connector and cable assembly, antenna, and RF hardware design


• Direct customer design and support experience


• Application and test knowledge of high-speed devices and equalization techniques


• Design experience with high-speed servers, switches, routers, storage, antenna, RF frontend or similar systems


• Those applicants not at Principal Engineering level, but can illustrate competencies in power or high speed interconnect and architecture will be considered.

Competencies