Principal Process Engineer, APTD Bonding

Identify, diagnose and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluation / optimization initiatives and make changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Lead audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Bachelor's or Master's degree in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field or equivalent experience 8 years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry Strong architectural sense to translate process/design into technical requirements and specifications 10 years expertise in data extraction, analysis, and reporting tools such as JMP, Python, R In-depth understanding of process flows, interactions, and their effects on yield, performance, and reliability Technical knowledge and hands-on experience in die-to-wafer and wafer-to-wafer bonding processes and equipment is a must. Experience in various assembly processes like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures Master's or PhD in Materials Science, Chemistry, Physics, Mechanical or Metallurgical Engineering