Process Engineer Die to Wafer Hybrid Bonding

Join the Photonics Platforms Business Group within the CTO Office at Applied Materials\u2019 Santa Clara headquarters, where you will work with a world\u2011class research team developing next\u2011generation optical interconnects technologies.\n\nWe are seeking hands\u2011on Process Engineers to drive die\u2011to\u2011wafer (D2W) hybrid bonding R\u0026D for silicon photonics and co\u2011packaged optics applications. This role focuses on hybrid bonding process development, pathfinding, technology de\u2011risking, and integration exploration.\n\nThe engineer will develop and evaluate novel bonding flows enabling photonic\u2013electronic co\u2011integration, a critical enabler for AI and HPC systems. The role provides on\u2011the\u2011job training and hands\u2011on experience with state\u2011of\u2011the\u2011art equipment, including the industry\u2019s first fully integrated die\u2011to\u2011wafer hybrid bonding system.\n\nKey Responsibilities\n\n * Develop die\u2011to\u2011wafer hybrid bonding processes, including (but not limited to):\n * Surface preparation and plasma activation\n * High\u2011accuracy die placement and alignment\n * Post\u2011bond characterization and process evaluation\n * Integrate D2W bonding with adjacent process modules such as:\n * Dicing and die preparation\n * Die thinning\n * Inter\u2011die gap fill and planarization\n * Design and execute DOE\u2011driven experiments to understand process limits, sensitivities, and trade\u2011offs.\n * Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.\n\n\n\nQualifications\n\n * M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.\n * In\u2011depth knowledge and hands\u2011on experience in one or more of the following:\n * Die\u2011to\u2011wafer or wafer\u2011to\u2011wafer bonding\n * Thin\u2011die handling and alignment\u2011critical processes\n * Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)\n * 2.5D/3D integration\n * Strong understanding of:\n * Bond interface physics\n * Alignment and overlay fundamentals\n * Mechanical behavior of thin and fragile dies\n * Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).\n * Self\u2011starter with strong problem\u2011solving skills; able to work both independently and collaboratively with minimal supervision.\n * Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.\n\n\n\n## Qualifications\n\n### Education:\n\nBachelor\u0027s Degree\n\n### Skills\n\n3D Integration (Inactive), Wafer Bonding Systems\n\n### Certifications:\n\n### Languages:\n\n### Years of Experience:\n\n7 - 10 Years\n\n### Work Experience:\n\n## Additional Information\n\n### \n\n### Shift:\n\n10-Day 8-Hr (United States of America)\n\n### \n\n### Travel:\n\nYes, 10% of the Time\n\n### \n\n### Relocation Eligible:\n\nYes\n\n### Referral Payment Plan:\n\nNone\n\nU.S. Salary Range:\n\n$147,000.00 - $202,500.00\n\nThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. \n\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\n\nApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. \n