Process Integration Engineer

Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability. Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies. Coordinate and manage process, equipment, and material evaluations. Validate and qualify new processes, tools, and materials for new product introduction. Manage and audit material suppliers to meet quality, cost, and risk objectives. Be prepared to work a shifted schedule as the need arises. Bachelor's degree with 3+ years of HVM or FAB experience 3+ years of experience working with Memory Technology 2+ years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement. Clear understanding of transistor operations, scaling limitations and reliability Basic knowledge of CMOS and characterization methods Master's or Ph.D. degree in Material science, Electrical, Electronics, Chemical or Engineering areas Experience with TD, Process Integration, Device, Yield analysis, QR Experience working with 300mm semiconductor environment. Proven knowledge of tech transfer and development