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Product Management - Packaging

Job Description - Product Management - Packaging

Develops abstract scope business & marketing plans, assesses market penetration and product positioning to drive competitive advantage, revenue and market share Recommends investment decisions for new product development Conducts abstract competitive analysis for specific products or product lines. Regarded as the technical expert in their particular field Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function Anticipates business and regulatory issues; recommends product, process or service improvements Leads projects with notable risk and complexity; develops the strategy for project execution Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view Ph.D. in Electrical/Chemical Engineering, Materials Science, Physics, or related field. Minimum 5 years of experience in semiconductor industry, preferably in advanced packaging or heterogeneous integration. Strong technical understanding of wafer-level processes, interconnect technologies, and integration flows. Excellent communication and presentation skills for technical and executive audiences. Proven project management experience and ability to lead cross-functional initiatives. Strong business acumen with ability to link technical capabilities to market value. Experience in leading-edge semiconductor manufacturing or ecosystem companies (e.g., major IDMs, foundries, or equipment suppliers). Familiarity with hybrid bonding, TSV, RDL, and advanced packaging architectures. Ability to perform competitive benchmarking and articulate differentiation. Experience turning technology strategy into market-driven business plans.
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