Analyze product yield data to identify root causes of low yield. Partner with cross‑functional engineering teams to resolve process- and defect‑related issues. Conduct physical failure analysis to understand mechanisms related to assembly defects and fabrication processes. Apply statistical tools and methodologies to drive yield improvement initiatives. Follow lab and chemical safety procedures while utilizing and developing best‑known methods. Bachelor's degree in Chemical Engineering, Mechanical Engineering, or Materials Science & Engineering. Ability to work rotating day‑to‑night shifts in four‑month intervals. Strong problem‑solving skills and ability to work independently. Excellent organizational skills and attention to detail. Ability to follow established lab procedures and safety protocols. Experience or training in Physical Failure Analysis. Familiarity with semiconductor manufacturing processes and test flows. Ability to build and maintain strong customer and internal partner relationships. Expertise or developing skills with FIB (Focused Ion Beam) and SEM (Scanning Electron Microscope) tools. Demonstrated behaviors including teamwork, drive for results, integrity, and continuous self‑development.
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