Location: Beijing, Shenzhen, or Wuhan, China (remote with regular customer/site engagement)
Department: Global Partnerships / Interconnect Business
Reports To: VP Business Development & CTO Global Partnerships
You will work hands-on with engineering teams at major cloud providers, leading OEM/ODMs, emerging AI system developers, and silicon ecosystem partners to enable successful design-in of the company's silicon and optical interconnect technologies. This role is crucial to influencing product requirements, driving adoption, accelerating design cycles, and increasing win-rate velocity in one of the world’s most dynamic compute and networking markets.
Key Responsibilities
Provide pre-sales technical leadership for the company's Interconnects portfolio across hyperscalers, OEM/ODMs, and AI/compute system partners in China, Taiwan, and Asia.
Lead lab bring-up, debug, interoperability validation, configuration, and performance testing.
Translate customer system architectures and requirements into technical solutions and roadmap inputs.
Support quoting decisions, technical documentation, product collateral, compliance materials, and solution configuration.
Partner with BD and account teams to guide complex design-win cycles from evaluation to production.
Serve as the primary technical interface for proofs-of-concept (POCs), interoperability events, compliance, and early deployments.
Deliver technical workshops, product demos, architecture sessions, and executive-level technical briefings.
Gather competitive intelligence, ecosystem developments, and silicon/optics trends to influence PLM and roadmap alignment.
Support post-sales issue triage with R&D, sustaining engineering, and quality teams — ensuring customer success during scale-up.
Advocate for customer requirements while balancing product strategy, roadmap alignment, and commercial constraints.
Key KPIs
Number and velocity of design wins
Lab evaluation cycle time reduction
Successful POCs and interoperability tests
Forecast accuracy for ramping programs
Product feedback captured and actioned into PLM
Customer technical satisfaction and adoption rate
Required Experience & Skills
10 years in sales/solutions engineering, high-speed hardware, optical interconnect, silicon bring-up, or datacenter systems engineering.
Deep familiarity with one or more of: DSP/retimer, SERDES, optics/pluggables, AEC/ACC, PCIe, Ethernet, high-speed test equipment.
Experience working directly with Asia-based hyperscalers and cloud builders (e.g., Alibaba Cloud, Tencent, Baidu, ByteDance) and/or major OEM/ODMs (e.g., Huawei, ZTE, H3C, Foxconn/Hon Hai, Quanta, Wiwynn, Inventec).
Hands-on debugging with oscilloscopes, BERTs, IBIS-AMI, simulation, or signal integrity tools.
Ability to engage simultaneously at engineering depth and executive clarity.
BS in Electrical Engineering, Computer Engineering, or similar required; MS preferred.
Fluent Mandarin and professional English (written and spoken); reading proficiency in Traditional Chinese a plus to support Taiwan customers.
Strong communication, documentation, and presentation skills — able to translate between engineering, PLM, and commercial audiences.
Personal Attributes
Highly autonomous, accountable, and comfortable in fast-evolving environments.
Strong customer empathy and ability to navigate technical and organisational ambiguity.
“Builder” mindset — thrives in high-growth, high-expectation environments.
Ability to represent Ciena Interconnects with credibility inside next-generation AI and compute ecosystems across China, Taiwan, and Asia.
Travel
Travel up to 40%, including customer labs and interoperability events across China, Taiwan, and the broader Asia region, plus periodic global team sessions.
Pipeline overview:
Location Group | Count | Comment |
|---|---|---|
Beijing / Beijing districts | 28 | Strongest pool, includes Alibaba, Tencent, Broadcom, Cisco, Huawei, Juniper, NVIDIA, Marvell |
Shenzhen | 9 | Good for hardware FAE, optics, Coherent, Lumentum, Marvell, Tencent |
Wuhan | 2 | Smaller but relevant, Broadcom/Credo FAE profiles |
Remote / China-wide | 4 | Cisco, Huawei, NVIDIA, Broadcom agent profiles |
Other China locations | 14 | Shanghai, Nanjing, Hangzhou, Suzhou, Guangzhou |
Ecosystem | Count | Examples |
|---|---|---|
Hyperscaler / China Cloud | 14 | Alibaba Cloud, Tencent, ByteDance, Huawei Cloud |
Silicon / AI Networking | 14 | NVIDIA, Marvell, Credo, Astera Labs, Mellanox |
Broadcom ecosystem | 12 | Broadcom, Broadcom Inc., Broadcom Limited, Avago, Atek, Sunray |
Datacenter / Network OEM | 12 | Cisco, Juniper, Nokia |
Optics / Transceiver | 5 | Coherent, Lumentum, InnoLight |
Priority | Profile Type | Why |
|---|---|---|
1 | Principal / Staff / Senior FAE from Broadcom, Marvell, Credo, Astera, NVIDIA/Mellanox | Best match for silicon, interconnect, customer debugging, design-win cycles |
2 | Network / Optical Network Architects from Alibaba Cloud or Tencent | Strong hyperscaler customer-side view, especially if exposed to datacenter, AI cluster, or optical network architecture |
3 | Solutions Architects from NVIDIA | Strong AI infrastructure relevance, likely exposure to GPU clusters, datacenter architecture, and high-speed networking |
4 | Data Centre Network Architect from Huawei | Very relevant for China customer landscape and datacenter networking |
5 | FAE / Optical profiles from Lumentum, Coherent, InnoLight | Strong optics/interconnect relevance, especially if customer-facing |
Note Disclaimer: Please ignore the salary range stated below.
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