RF Design Engineer (Tile Design level 3 or 4)

Designing, modeling, and verifying RF/microwave and mixed signal CCAs Participate in RF hardware requirements verification and flow downs. Developing and executing detailed test procedures to verify functionality and interfaces. Support payload level integration with higher level assemblies and tests. Design, create, and modify Electrical Ground Support Equipment (EGSE) to support I&T activities Developing, planning, executing, and overseeing the integration and test activities for the Payload support electronics box. Principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 5 years of relevant engineering experience (3 years with MS degree; or 0 years with PhD) Sr. principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD) Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Xpedition, ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Altium, FEKO, TICRA) Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty Active Top Secret / SCI security clearance Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis) Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming High-speed digital circuit design experience Familiarity with Point of Load (PoL) design Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required) Understanding of basic signal processing RF budgeting, frequency planning, RF chain analysis and modeling Component selection and/or custom component requirements flow down and trades Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip Product life cycle support from concept through production support Designing for high reliability, space requirements and environments AESA / phased array, Radar, SIGINT, or SATCOM experience