Scientist, Mechanical Engineering (Electronics Packaging)

Job Title: Scientist, Mechanical Engineering (Electronics Packaging)

Job Code: 32911

Job Location:  Plano, TX

Job Schedule: 9/80 (Every other Friday off!)

Relocation: Relocation assistance is available to qualified applicants

Job Description: 

The Agile Development Group (ADG) specializes in developing disruptive, next-generation technologies for advanced Unmanned Air Systems (UAS / UAV), advanced radar systems, next-generation weapon systems, and other RF sensor technologies using small company agility and big company experience. Team is seeking an Electronic Packaging Mechanical Engineer to work with a cross-functional team to develop, design, and implement radar systems. The position will follow the product from conceptualization through hardware integration and test.  The position will interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts. The position will require leading the mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly and qualification of product to the specification requirements, typically with stringent technical, schedule, and process requirements. Candidate must have experience in 3D modeling, critical HW design and development to include environmental requirements, power delivery, and aggressive thermal management.  Candidate must have the ability to work independently and within a multi-disciplined team environment.  Candidate must have experience leading team and pushing forward mechanical technologies.

Essential Functions: 

• Proposal support and development


• Assist with developing overall site wide Mechanical strategy


• Work closely with cross-functional teams in the development of new solutions.


• Significant CAD modeling of parts & assemblies


• Perform trade studies to determine optimal designs


• Review Structural and thermal analysis of components & assemblies


• Have deep understanding of thermal management of high-power electronics in constrained volumes.


• Electromechanical integration and electronics packaging


• Lead mechanical design efforts


• Lead peer reviews, PDRs, CDRs, and other required design reviews


• Schedule, cost, and technical responsibility at the major subsystem level


• Interface to customers & upper management


• Provide guidance and mentorship for other team members formally or informally


• Responsible for directing and reviewing the work of junior engineers and designers and technicians.


• Participate in risk assessment and develop mitigation strategies for complex projects


• Ability to obtain and maintain any additional clearances as required


• Proficiency in CAD tools such as Solidworks/Creo


• Take on roles such as IPT Lead when necessary

Qualifications:

• Bachelor’s Degree in engineering and minimum 12 years of prior relevant experience. Graduate Degree and a minimum of 10 years of prior related experience. In lieu of a degree, minimum of 16 years of prior related experience.


• Active Top Secret Security Clearance


• Experience with standard ASME Y14.5M-1994 and GD&T


• 6+ years experience in 3D CAD modeling – PTC Creo, Catia, NX, or Solidworks


• 8+ years experience packaging electronics including design for and testing to military environments (i.e. temperature, vibration, shock, etc.)


• 8+ years experience with thermal management of high-power electronics. 


• Experience leading in the generation of technical content for bids: scope capture, requirements development, materials pricing, and labor estimates as required

Preferred Additional Skills:

• Excellent people skills, with experience leading and collaborating in a multi-disciplinary, diverse, and dynamic team environment.


• Excellent communication skills (written, verbal, & presentation)


• Strong hands-on capabilities, to include integration and diagnosis of complex mechanisms and products


• Experience with EVMS cost and schedule practices