Senior Director, Advanced Packaging Disruptive Technology

The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness\u2014connecting customer needs to integrated equipment/process solutions and strategic partnerships.\n\nThis position operates at the intersection of technology roadmaps, account strategy, and disruptive pathfinding, translating panel scaling inflections into executable customer engagements, demo programs, and internal investment priorities.\n\nKey Responsibilities\n\n\u00b7 Panel Scaling Technology Strategy \u0026 Roadmap Ownership :\n\n\u00b7 Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures.\n\n\u00b7 Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle\n\nEcosystem \u0026 Partnership Development\n\n\u00b7 Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability).\n\n\u00b7 Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.\n\nProgram Governance \u0026 Executive Communication\n\no Lead executive-ready storytelling and decision frameworks\n\no Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging.\n\n\u00b7 Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes. Create a mechanism to communicate issues, track progress and pull resources from multiple divisions and/or functions. Uses sound statistical techniques like and problem solving methodologies DOEs (Design of Experiment) to quickly determine root cause and action plans. Communicates learnings from this portion to rest-of-world to strengthen the product packages.\n\n\u00b7 Serves as the customer expert across a broad range of exceptionally complex products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to division heads on process and hardware improvements to meet customer roadmap requirements.\n\n\u00b7 Directs the positioning of new technologies to customers utilizing technical information from divisions. Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs. Makes senior executive level presentations.\n\n\u00b7 Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.\n\nFunctional Knowledge\n\n\u00b7 Demonstrates broad and comprehensive understanding of different systems, theories and practices regarding advanced packaging as well as the changing business environment\n\nBusiness Expertise\n\n\u00b7 Applies in-depth advanced packaging knowledge, business and commercial expertise to differentiate itself from the competition\n\nLeadership\n\n\u00b7 Visionary Business \u0026 Technology Leader: Shapes strategy at the intersection of advanced technology and customer value, turning complex challenges into scalable, market\u2011leading solutions.\n\n\u00b7 Trusted Executive Partner: Builds credibility with C\u2011suite leaders, customers, and partners through clear communication, strong judgment, and a collaborative leadership style.\n\n\u00b7 Decisive Change Agent: Thrives in fast\u2011paced, ambiguous environments\u2014driving alignment, making high\u2011impact decisions, and delivering results.\n\n\u00b7 People\u2011First Leader: Inspires and develops world\u2011class teams, fostering a culture of innovation, accountability, and continuous growth.\n\nProblem Solving\n\n\u00b7 Evaluates key business challenges; directs the development of new or innovative solutions\n\nImpact\n\n\u00b7 Guided by company strategy and business objectives, impacts results of segment/function\n\nInterpersonal Skills\n\n\u00b7 Influences and negotiates at the top executive levels, with great latitude on\n\n\u00b7 outcomes; presents and defends complicated or delicate issues\n\nCore Qualifications\n\n\u00b7 15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains.\n\n\u00b7 Demonstrated leadership in technology strategy + customer execution (principal-level account leadership, platform adoption, or roadmap ownership).\n\n\u00b7 Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass \u0026 organic substrate trends, and manufacturing/yield constraints at large format\n\n\u00b7 Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners.\n\n\u00b7 Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.\n\nPreferred Qualifications\n\n\u00b7 PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience.\n\n\u00b7 Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures\n\n\u00b7 Demonstrated track record of ecosystem building (materials, substrate suppliers, research institutes, foundries/OSATs)\n\nTravel\n\n\u00b7 Travel as needed for strategic customer engagements, partner meetings, and industry/consortia events.\n\n## Qualifications\n\n### Education:\n\nBachelor\u0027s Degree\n\n### Skills\n\n### Certifications:\n\n### Languages:\n\n### Years of Experience:\n\n15+ Years\n\n### Work Experience:\n\n## Additional Information\n\n### \n\n### Shift:\n\n10-Day 8-Hr (United States of America)\n\n### \n\n### Travel:\n\nYes, 25% of the Time\n\n### \n\n### Relocation Eligible:\n\nYes\n\n### Referral Payment Plan:\n\nNone\n\nU.S. Salary Range:\n\n$200,000.00 - $275,000.00\n\nThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. \n\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\n\nApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. \n