Senior Engineer - Cu Hybrid Bonding

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At Qnity, we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

We are seeking a highly skilled and innovative engineer to lead our Copper Hybrid Bonding (CHB) development program. This role will focus on advancing next-generation interconnect technologies for high-performance packaging, leveraging deep expertise in grain engineering, copper bonding, and process integration.

Key Responsibilities

• Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration.
• Define technical roadmap, milestones, and deliverables aligned with business objectives.
• Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes.
• Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB.
• Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality.
• Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology.
• Act as the primary technical interface with customers to align bonding technology with product requirements.
• Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering.
• Identify opportunities for process differentiation and file patents to protect intellectual property.
• Stay ahead of industry trends and benchmark against leading-edge CHB technologies.

Qualifications

• Master’s degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred.
• Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred.
• Experience and knowledge in semiconductor packaging or interconnect technology development required.
• Proven expertise in grain engineering, copper bonding, and hybrid bonding processes.
• Hands-on experience with electrochemical deposition, CMP, and surface activation techniques.
• Strong analytical and problem-solving skills.
• Familiarity with reliability testing and failure analysis for bonded interfaces.
• Excellent communication and leadership abilities.

Preferred Qualifications

• Hands-on experience with hybrid bonding, TSV plating, and damascene metallization.
• Familiarity with additive chemistry development for electroplating baths.
• Knowledge of failure analysis, stress modeling, and reliability testing.
• Track record of patent generation and technical leadership.

Soft Skills

• Excellent problem-solving and analytical skills.
• Strong communication and collaboration abilities.

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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.

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