Senior Manufacturing Engineer Thin Film Engineering (PVD, PECVD, ALD & RIE)

About Ensurge Micropower

Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology,
enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for
wearables, health tech, industrial sensing, and defense applications. As our technology
transitions from development to production, disciplined manufacturing execution becomes the
differentiator.

Role Overview
Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film
Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from
pilot through early production. This role is not just about process — it is about delivering
manufacturing results.

Responsibilities

Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE
process areas

• Drive output, yield, uptime, and cycle time


• Support production directly — troubleshooting issues in real time


• Partner with Operations to ensure line execution meets plan
  

Convert R&D processes into repeatable, production-ready workflows

• Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process
  gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness
  uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle
  count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas
  chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias,
  and endpoint detection (RIE)


• Define and lock control limits and OCAPs


• Ensure processes are robust, stable, and scalable
  
  Work with Equipment Engineering to:


• Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and
  precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems,
  RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)


• Improve reliability and uptime


• Implement process-driven upgrades


• Lead tool qualification and process acceptance


• Ensure equipment supports throughput, precision, and repeatability
  
  
  
  Own flow from substrate input → deposition/etch → downstream handoff to assembly


• Reduce bottlenecks, WIP, and inefficiencies


• Improve line balance and production scheduling alignment


• Support layout and flow improvements as the system scales
  
  Partner with Quality to implement:


• SPC and process control on film thickness, stress, uniformity, and conformality


• Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs


• Traceability and data capture
  
  Build and maintain:


• SOPs


• Process specs


• Control plans


• Ensure manufacturing is data-driven and auditable   
  
  Lead structured RCA on:


• Yield loss


• Defects


• Downtime


• Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions


• Implement sustainable fixes — not workarounds


• Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.)
  
  Qualifications
  
  Required
  
  


• 7–12+ years in manufacturing engineering with thin-film deposition and etch
  (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film
  industries


• Proven experience owning manufacturing processes on the floor


• Strong track record of driving yield and throughput improvements


• Experience supporting or leading pilot → production scale-up


• Hands-on mindset — comfortable working directly with equipment, technicians, and
  operators


• Working knowledge of thin-film characterization techniques (e.g., ellipsometry,
  profilometry, XRD, SEM) and their use in validating and controlling deposition processes
  
  Preferred
  
  


• Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias


• Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection
  (RIE/ICP-RIE)


• Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing


• Vacuum systems and chamber conditioning experience


• Experience with image-based film/defect characterization (SEM, optical microscopy) and
  correlating characterization data back to process control limits


• Experience with MES, traceability systems, or data-driven manufacturing
  
  Salary Range:
  $162,000-$198,000
  The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.