Main Responsibilities:
and via structures, from schematic capture through manufacturing release.
• Translate schematics, system requirements, and signal-integrity constraints into robust, manufacturable board layouts at sub 0.4 mm pitch.
• Drive high-speed design practices, including impedance-controlled routing, differential pair tuning, length matching, and power-integrity optimization.
• Collaborate closely with IC design, packaging, hardware, mechanical, and engineering teams to ensure seamless integration across the full product stack.
• Adhere to DFM, DFF, DFT, resolve manufacturability issues, and ensure compliance with industry standards and internal quality guidelines.
• Oversee the generation of fabrication and assembly documentation, including Gerbers, ODB++, drawings, and build notes.
• Champion continuous improvement in design workflows, automation, and tool utilization to increase efficiency and design quality.
Required Skills and Qualifications:
• 5+ years’ experience with industry-standard ECAD tools, such as Cadence Allegro, Altium Designer, or Siemens/Mentor Graphics.
• Thorough understanding of mix-signal, HDI, complex via stack-ups and WLCSP design principles.
• In-depth knowledge of IPC standards and design for manufacturing (DFM) guidelines.
• Conduct design reviews, provide guidance to junior designers, and uphold best-practice methodologies across the layout team.
• Producing deliverables to defined schedules, ensuring timelines are met
• Strong communication, analytical, problem-solving, and organizational skills with meticulous attention to detail.
• Strong desire to be part of a cohesive culture and strong design team.
Preferred Skills and Qualifications:
• Knowledge of ATE (HIBs, PIBs, Probe Cards) and semiconductor reliability stress (HAST/HTOL) hardware.
• Experience and understanding of AI tools and how they can enable design efficiency
• CID and CID+ certification.