- Technical Leadership
· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry
· Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling)
· Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability
Advanced PCB Design & Layout
· Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance
· Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals
· Design robust power distribution networks and grounding structures
· Apply advanced shielding and isolation techniques for EMI/EMC control
Fabrication & Assembly Interface
· Lead DFM/DFA reviews with PCB fabrication and assembly partners
· Resolve complex DFM issues related to:
o HDI structures and sequential lamination
o Via consolidation, backdrilling, and drill count reduction
o Stackup optimization for yield and cost
· Optimize designs for manufacturability, reliability, and volume production
Cross-Functional Collaboration
· Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle
· Support board bring-up, debug, ECOs, and production transitions
· Mentor and technically guide junior PCB layout engineers
Documentation & Process Ownership
· Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)
· Establish, maintain, and enforce PCB layout standards and best practices
· Drive continuous improvement in layout quality, DFM compliance, and cost efficiency