Sr. Director, Packaging and Reliability Quality

Closely partnering with the Advanced Package Technology Development and Package Development Engineering organizations to identify new and unique quality and reliability challenges, including chip-to-package interactions, and ensuring they are addressed during the design and development phase of the product life cycle. Executing package reliability qualification and ongoing package quality and reliability monitoring in manufacturing. Driving continuous improvement in package reliability test coverage with an understanding of varying use conditions. Managing the Global Quality package reliability lab operations around the globe. Build an effective team with subject matter experts and optimize department performance and structure. Establish organizational roadmaps and strategies to drive long term vision for the organization.​ Ensure team members are properly trained according to department compliance and work requirements ​ Manage internal budgets including capex optimization for package qualification sites for various product You must have at least 20 years of proven experience in high-value/high-volume semiconductor packaging/assembly engineering and/or manufacturing, with at least 10 years in a global leadership role. You should have substantial experience and/or knowledge in managing large-scale global organizations, with a consistent track record of leading high-performing teams. Excellent communication and interpersonal skills, with the ability to work effectively at all levels, are essential.