T

Sr. Engineer, Package Design

salary Salary :

$100,000 - 500,000 yearly

icon building Company : Tenstorrent
icon briefcase Job Type : Full Time

Number of Applicants

 : 

000+

Click to reveal the number of candidates who applied for this job.
icon loader
Apply Now
icon loader Apply Now

Let AI Supercharge Your Job Hunt!

JobCopilot scans 500,000+ company career sites daily to find jobs for you

Never miss an opportunity Save hours by auto-filling applications forms Land more interviews with tailored applications
happy man
thunder iconActivate JobCopilot

Job Description - Sr. Engineer, Package Design

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

We are seeking a designer to create board-level routing studies, design mock-ups, and SI/PI modeling collateral that support advanced semiconductor package development. This role is focused on early-stage package/board co-design rather than production PCB release. The designer will work closely with signal integrity, power integrity, mechanical, and system teams to develop representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.


This role is hybrid, based out of Santa Clara, California, Austin, Texas, Toronto Canada or New Taipei City, Taiwan.


We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.


 


Who You Are



  • An experienced PCB designer looking to expand into advanced semiconductor packaging and package-board co-design.

  • Comfortable working in ambiguous problem spaces and using engineering judgment to evaluate multiple implementation tradeoffs.

  • Interested in understanding how package architecture, BGA design, and board implementation influence overall system performance.

  • Motivated by solving complex routing, connectivity, and electrical design challenges.

  • Excited to apply automation, data analytics, and emerging AI techniques to improve engineering workflows.


What We Need



  • 3+ Years experience with Cadence Allegro PCB Designer.

  • Experience with high-pin-count BGAs and complex connectivity requirements.

  • Ability to analyze routing congestion, layer utilization, and signal escape strategies.

  • Working knowledge of Signal and Power Integrity principles.

  • Strong communication skills and the ability to collaborate across multiple engineering disciplines.


What You Will Learn



  • How to effectively drive co-design across silicon, packages, and systems.

  • Advanced packaging concepts including chiplets, 2.5D Packaging, and On/Off-Package Memory.

  • Power delivery architectures ranging from traditional lateral solutions to emerging vertical power delivery approaches, including backside power delivery, integrated voltage regulators, and package embedded passives.


 


Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.


Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.  Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).   These requirements apply to persons located in the U.S. and all countries outside the U.S.  As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.  If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

Original job Sr. Engineer, Package Design posted on GrabJobs ©. To flag any issues with this job please use the Report Job button on GrabJobs.
Apply Now
Share Job
Share Job

Auto-Apply to Sr. Engineer, Package Design Jobs with your AI JobCopilot

thunder icon Auto-Apply with AI

Similar Sr. Engineer, Package Design Jobs in the US

GrabJobs is the no1 job portal in the US, connecting you to thousands of jobs fast! Find the best jobs in the US, apply in 1 click and get a job today!

Mobile Apps

Copyright © 2026 Grabjobs Pte.Ltd. All Rights Reserved.