Staff Engineer, APTD Backgrind/Edge Trim

Req ID:\n\nJR94147 Staff Engineer, APTD Backgrind/Edge Trim\n\nOur vision is to transform how the world uses information to enrich life for all.\n\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\n\nDepartment Intro:\n\nThe Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R\u0026D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration!\n\nPosition Overview:\n\nThis role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind \u0026 Thinning R\u0026D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets.\n\nResponsibilities:\n\n * Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron\u2019s advanced memory products.\n\n * Improve process capability, yield, cost efficiency, and wafer integrity through data\u2011driven optimization and equipment or consumable innovation.\n\n * Conduct root\u2011cause and failure\u2011mode analyses to understand wafer damage mechanisms such as edge chipping, micro\u2011cracks, subsurface damage, warpage, and residual stress, and drive mitigation strategies.\n\n * Perform fundamental research and early\u2011stage pathfinding to enable ultra\u2011thin wafer processing for next\u2011generation advanced packaging architectures.\n\n * Support process transfer and ramp to production at manufacturing sites; limited domestic and/or international travel may be required.\n\n\n\n\nMinimum Qualifications:\n\n * BS or MS degree with a minimum of 4 years of experience in wafer edge trim, backgrind, wafer thinning, CMP, or mechanical wafer processing in the semiconductor industry\n\n * Demonstrated research and development capability in science or engineering, with hands\u2011on experience advancing wafer processing capability through structured experimentation and learning.\n\n * Proven expertise in experimental design (DOE), data analysis, and result interpretation, translating findings into actionable process or technology improvements.\n\n * Strong analytical, physics\u2011based, and creative problem\u2011solving skills, applied to complex mechanical, material, and defect\u2011related wafer challenges.\n\n * Ability to apply deep understanding of wafer thinning, backgrind, and edge trim processes to influence technology direction, integration strategies, and long\u2011term roadmap decisions.\n\n * Proven success resolving complex process, yield, and reliability issues using root\u2011cause analysis, model\u2011based reasoning, and first\u2011principles understanding\n\n * Self\u2011motivated and capable of working independently with minimal supervision, while consistently delivering on technical and program commitments.\n\n * Demonstrated ability to manage numerous projects simultaneously, balancing near\u2011term execution with longer\u2011term R\u0026D objectives.\n\n * Strong computer proficiency, including MS Office and data visualization tools, for effective reporting and executive\u2011level communication.\n\n\n\n\nPreferred Qualifications:\n\n * PHD in a related field with 2+ years of relevant industry experience\n\n * Proficiency in statistical analysis and statistical process control (SPC); experience applying statistics to variability reduction and process optimization\n\n * Exposure to or strong interest in advanced packaging technologies such as wafer\u2011level packaging, bonding/de-bonding, or 2.5D/3D integration is highly desirable\n\n * Familiarity with data science fundamentals, including Python scripting, automation, or GenAI\u2011enabled analysis\n\n\n\n\nJob Profile(s):\n\nSemiconductor Process Engineer 4\n\nRelocation Level: TBD\n\nBefore Getting Started \nPlease review Micron\u2019s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: \n\n * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.\n * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.\n\n\n\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc\n\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\n\nTo learn about your right to work click here.\n\nFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron\u2019s People Organization at [email protected] or 1-800-336-8918 (select option #3)\n