Staff Process Engineer, APTD Bonding

Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead/participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site-to-site portability Manage/audit material suppliers to achieve quality, cost and risk management objectives BS + 5 years experience, MS + 3 years experience, or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields Knowledge of Advanced Package Integration and DRAM, NAND, or other memory Ability to manage multiple projects to ensure deliverables are completed on time and on budget Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions Ability to resolve complex issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the team.