Staff Process Integration Engineer, APTD

Own package‑level process integration across 2.5D/3D flows (wafer-to-wafer, chip-to-wafer, advanced interconnects), defining specs and process windows that meet high performance targets for HPC/AI products Develop and integrate semiconductor manufacturing processes. Design, optimize, and implement fabrication flows that seamlessly integrate multiple steps, including lithography, etch, deposition, diffusion, CMP, and thin films, into cohesive production processes. Analyze yield, performance, and defect data to root-cause process weaknesses, yield issues, and tool variances; Employ SPC and advanced analytics. Lead technology transfer from TD to TD and HVM, establishing mask rules, materials, tool readiness, baseline qualification, and technology validation plans Design and execute experiments (DOEs) on bonding, underfill, molding, stacking, and integration steps. Apply SPC to parametrics and yield detractors, validate new materials, design rules to improve yield and device performance, and close the loop with corrective actions. Manage hybrid bonding (Cu‑Cu + dielectric) integration. Set surface prep, planarity, and alignment requirements. Qualify W2W/C2W flows and track defectivity and reliability. Optimize underfill, TC bonding windows, and pillar/bump geometries for high‑I/O assemblies Co‑optimize TSV/interconnect routing and thermal paths to meet bandwidth/latency targets, aligning package floorplans with chiplet partitioning Predict and mitigate wafer/die warpage engineering via modeling, cure‑shrinkage controls, and material/process levers; Validate with inline metrology. Leverage metrology and inspection skills to deploy SAM, IR microscopy, and emerging XRD warpage mapping to correlate processes, defects, and reliability BS or MS in Materials/Chemical Engineering 6+ years in semiconductor technology development with cleanroom experience Hands‑on knowledge of advanced interconnects and bonding flows Proficiency in DOE/SPC and data analysis (JMP/Minitab/Python) with demonstrated root‑cause problem solving and yield improvement Experience with metrology; SAM, X‑ray/CT, IR, warpage profilers (shadow moiré/DIC) Strong communication and technical writing skills with the ability to lead cross‑functional teams and drive action in fast‑paced environments Direct experience with hybrid bonding integration and reliability (W2W/C2W) Warpage modeling and inline correlation experience