Identify and characterize new yield issues by tracking probe yields and trends, and explain gaps between target and actual yields. Perform advanced data analysis and characterization to quantify issues, generate an accurate yield pareto to guide the fab on issues limiting yield. Use statistical tools and data-mining techniques to identify root causes and opportunities for improvement. Work closely with the Failure Analysis (FA) team, including Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA), to correlate electrical signals with probe signatures and data-mining insights, delivering a comprehensive view to process teams for effective issue resolution. Partner with module and inline monitoring teams to ensure timely implementation and monitoring of yield fixes, providing clear handoffs and alignment to drive sustainable improvements. Suggest new ideas and collaborate with the global network to develop best known methods and maintain alignment between sites Apply semiconductor process knowledge, defect inspection, metrology, and process control fundamentals. Master's degree in Computer Science or related technical field. 6 + years of semiconductor experience. 10+ years experience in semiconductor physics and understanding of transistor operations, scaling limitations and reliability; basic knowledge of CMOS circuits and characterization methods. Deep experience using at least one software (JMP, Python etc) Experience in multi-functional programs across several groups that has been adopted. Ability to influence a BKM and implement solution across the network. DRAM experience 5+ years of experience as Yield Analysis engineer or RDA in a MFG/HVM environment.
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