Structural Engineer, Global Facilities

Lead structural design and construction support for advanced semiconductor manufacturing, cleanroom, and support facilities across U.S. sites, ensuring alignment with stringent operational, seismic, and contamination control requirements. Develop and review structural systems including foundations, slabs‑on‑grade, superstructures, steel and concrete framing, and equipment support structures for vibration‑sensitive cleanroom environments. Perform and oversee structural analysis and design for gravity, lateral, seismic, wind, and equipment loads in accordance with governing codes and semiconductor‑specific performance criteria. Collaborate with multidisciplinary teams (Civil, Architectural, MEP, and Process Engineering) to integrate CSA systems into complex semiconductor facility designs. Prepare and review detailed structural drawings, specifications, calculations, and delegated design packages for steel, concrete, and specialty structural systems. Support construction teams during execution by resolving structural design issues, reviewing RFIs and submittals, and providing field engineering support as needed. Manage structural design scope, schedule, and coordinating closely with project managers, estimating teams, and construction partners. Ensure compliance with local building codes, seismic requirements, safety laws, and internal semiconductor facility standards through rigorous design reviews and change management processes. Participate in bid evaluations, cost estimating, value engineering, and contractor selection for structural work packages. Provide technical feedback for permitting, authority‑having‑jurisdiction (AHJ) coordination, and regulatory reviews related to structural and seismic design. Capture lessons learned and contribute to the development and continuous improvement of Global Facilities structural standards and protocols. Bachelor's degree in Structural Engineering, Civil Engineering (with structural emphasis), or related field, or equivalent experience. Minimum 5 years of experience in structural design for semiconductor, advanced manufacturing, or other complex industrial facilities. Strong knowledge of structural analysis, foundation design, and structural systems for vibration‑ and seismic‑sensitive environments. Proficiency in structural design and analysis software (e.g., ETABS, SAP2000, RAM, STAAD, SAFE) and drafting/modeling tools (e.g., AutoCAD, Revit). Solid understanding of U.S. building codes and standards (IBC, ASCE 7, ACI, AISC). Professional Engineer (PE) or Structural Engineer (SE) license, or ability to obtain licensure. Experience with cleanroom structural design constraints, vibration criteria, and integration of CSA systems in semiconductor facilities. Strong background in seismic design and analysis for high‑risk or critical facilities. Experience managing structural design packages and delegated design scopes on large capital projects. Familiarity with construction means and methods for steel and concrete structures in fast‑paced, safety‑critical environments.