Structural/ Thermal Modeling Engineer 3

Developing physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry. Experience in commercial software like ABAQUS, ANSYS, NASTRAN, COMSOL, etc., is highly desirable. Developing methods for translating tool operational data into improved engineering designs Developing and maintaining live multi-physics models Provide written reports and oral presentation of results to design teams and management. Work directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans. PhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer and fluid mechanics or related fields. Strong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software. Coding ability to supplement commercial software for specific applications as needs arise. Ability to work within a team to own and design concepts and drive design decisions. Ability to lead and conduct design reviews in cross functional and matrixed environments. Strong written and oral communication. Self-starter to start own initiatives and projects for continuous improvement in capabilities and design. This is a graduate eligible role. Preferred knowledge of chemistry, semiconductor metrology methods, and employing sensors and hardware designs in a vacuum environment is also a plus.