Wafer Bond Process Development Engineer

Rigorous process ownership which includes new process development and sustaining of your current process. Collaborating with Equipment teams, Process Development and Process Integration to develop innovative process engineering solutions. Optimizing processes and equipment to reduce cost, process variability, and improve process capability. Strong logic and problem-solving skills and thought processes based on model-based problem solving. Mature understanding of the process flow related to area equipment, SPC principles, and recipe management. Bachelor of Science + 3yrs experience or Master of Science / PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields or relevant experience Hands-on experience with wafer bonding Knowledge of DRAM, or other memory. Ability to communicate effectively and efficiently to a variety of audiences Hands on experience with wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). Strong leadership skills with the shown ability to coordinate efforts across a variety of groups Able to efficiently organize multifunctional teams to complete projects on time Strong teamwork skills